Silicone Thermally Conductive Encapsulant

Tia208r has the unique benefit of providing primerless adhesion when cured at both elevated heat or at room temperature to not only metallic substrates but to also.

Silicone thermally conductive encapsulant.

Primerless adhesion to metals and plastics. Home thermally conductive silcool tia208r thermally conductive silicone encapsulant. The practice of using silicone in encapsulating and potting electronic components is a well established process designed to protect delicate circuitry. They also provide protection from harsh environments vibration and thermal shock.

Fast cure 2 component room temperature curable thermally conductive potting material. Lord cooltherm sc 6703 thermally conductive silicone encapsulant is a two component system designed to provide thermal conductivity for encapsulating densely packed power units. Thermally conductive encapsulant designed for fast fill rates and reworkability with moderate thermal conductivity gray 3 200 addition cure. Two part 1 1 1 hr 40 24 hrs 30 min 60 c 1 58 45 1 8 85 24 ul 94 v 0 dowsil cn 8760 thermally conductive encapsulant even higher flow version of dowsil cn 8760 g encapsulant dark gray 2 700.

Silco therm thermally conductive silicone encapsulants can be used in potting applications to dissipate heat away from a component to a suitable heat sink. Thermally conductive silicone adhesives momentive performance materials developed its family of silcool thermally conductive adhesives to help deliver thin bond lines which contribute to low thermal resistance while providing excellent adhesion and reliability. Thermally conductive silicones from dow come in a wide range of viscosities cure speeds and delivery systems to meet the growing need for improved thermal management in electronics designs for virtually every industry. Dowsil cn 8760 thermally conductive encapsulant please contact dow for distribution options available for this product.

Lord cooltherm sc 324 thermally conductive silicone encapsulant is a two component system designed to provide excellent thermal conductivity for electrical electronic encapsulating applications while retaining desirable properties associated with silicones.